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Midwest HVAC News
Emerson 2019 ASCO
Engineering Scholarship Program is Now Open for Applications.
The merit-based scholarships reward students' potential for
leadership and contributions to the engineering and related
professions.
Emerson will begin accepting applications today for its
2019 ASCO Engineering Scholarship program, which rewards
students who have potential for leadership and contributions to the
engineering profession.
The program awards two $5,000 scholarships to U.S. engineering
students, provides $1,000 grants to their colleges’ engineering
departments, and hosts the students at “The Amazing Packaging Race”
at PACK EXPO International in 2019.
Applications will be accepted through April 23, 2019. Details and
forms are available at
https://go.emersonautomation.com/asco-engineering-scholarship.
"When you think about the amount of change happening in the
manufacturing industry and all the diverse fields and career tracks
that students can pursue, you are reminded how important it is to
reward their success," said Andy Duffy, vice president of sales for
fluid control and pneumatics at Emerson.
"The job opportunities in manufacturing are changing, and with that
comes greater focus on new innovations and technologies. Emerson is
built on that innovation, and that's why we're supporting students
who can contribute significantly to the future of the industry
through the ASCO Engineering Scholarship.”
Story
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Since the first
award 11 years ago, $110,000 in scholarships have been granted
to 22 U.S. students, making a significant contribution to the
engineering profession. In addition, the engineering departments
of the colleges where the recipients are enrolled have received
$22,000 in grants for education research.
The ASCO engineering scholarship is named for Emerson’s brand of
solenoid valves, invented in 1910, which led to a heritage of
innovation in engineering. It is Emerson’s mission to support
and inspire the next generation of innovators. The scholarship
is merit-based and will be awarded on the candidate’s experience
and potential for leadership, particularly as it relates to the
application of fluid control and pneumatics technologies. A
panel of Emerson executives and independent judges will select
the recipients.
Students seeking to submit a scholarship application must be
enrolled full-time in an undergraduate or graduate program in an
instrumentation, systems, electrical, mechanical, or automation
engineering discipline at an accredited U.S. educational
institution for the 2019/2020 academic year. Candidates must
also maintain at least a 3.2 cumulative GPA on a 4.0 scale and
be a U.S. citizen or legal U.S. resident.
The scholarship will be awarded at “The Amazing Packaging Race”
held the third and final day of PACK EXPO International, Sept.
23 - 25, 2019 in Las Vegas, Nevada. The race, sponsored by
Emerson, is a fun and educational event that pits teams of
college students, from programs around the country, against each
other in a race to gather points by completing tasks at specific
PACK EXPO booths
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